Printed circuit board consisting of at least two printed circuit board regions

ABSTRACT

In a method for producing a printed circuit board consisting of at least two printed circuit regions, wherein the printed circuit board regions each compromise at least one conductive layer and/or at least one device or once conductive component, wherein printed circuit board regions to be connected to another one, in the region of in each case at least one lateral surface directly adjoining one another, are connected to one another by a coupling or connection, and wherein, after a coupling or connection of printed circuit board regions, at least one additional layer or ply of the printed circuit board is applied over the printed circuit board regions, the additional layer is embodied as a conductive layer, which is contact-connected via plated-through holes to conductive layers or devices or components integrated in the printed circuit board regions.

The present invention relates to a method for producing a printedcircuit board consisting of at least two printed circuit board regions,wherein the printed circuit board regions each comprise at least oneconductive layer and/or at least one device or one conductive component,wherein printed circuit board regions to be connected to one another, inthe region of in each case at least one lateral surface directlyadjoining one another, are connected to one another by a coupling orconnection, and wherein, after a coupling or connection of printedcircuit board regions to be connected to one another, at least oneadditional layer or ply of the printed circuit board is arranged orapplied over the printed circuit board regions to be connected to oneanother. The present invention, moreover, relates to a printed circuitboard consisting of at least two printed circuit board regions, whereinthe printed circuit board regions each comprise at least one conductivelayer and/or at least one device or one conductive component, whereinprinted circuit board regions to be connected to one another, in theregion of in each case at least one lateral surface directly adjoiningone another, are connectable or connected to one another by a couplingor connection, and wherein, on printed circuit board regions connectedto one another, at least one additional layer or ply of the printedcircuit board is arranged over the printed circuit board regions to beconnected to one another.

PRIOR ART

In the context of the production of printed circuit boards, it hasbecome more and more common practice to produce or assemble a printedcircuit board of at least two, particularly separately produced, printedcircuit board regions consisting of regions that are horizontallyconnected and frequently made of different materials, wherein such amode of procedure, which is, for instance, known as modularization, is,for instance, applied because individual partial regions of a printedcircuit board have to meet different demands. Thus, it is, for instance,known that in partial regions of a printed circuit board powerelectronics is integrated or incorporated, while in other regions of aprinted circuit board digital technology is, in particular, applied. Theproduction of a printed circuit board simultaneously comprising, forinstance, power electronics and digital technology does not make sensein terms of both production expenditures and electrical and mechanicalcoupling designs, thus usually leading to elevated costs. In respect toan increasingly sought miniaturization of such printed circuit boards,different production techniques and methods which cannot be readilycombined with one another are, moreover, applied to an increasingextent.

Finally, such a printed circuit board that is assembled by couplingsuperimposed layers of different materials, i.e. has a so-called hybridstructure or includes partial regions with integrated high-frequency orpower electronics, usually comprises regions with different warm-uprates or different expansion coefficients such that, in practical usage,such a printed circuit board will frequently become warped or distorted,thus markedly reducing its service life and reliability.

For the production of printed circuit boards consisting of at least two,particularly differently constructed, printed circuit board regions, itis, for instance, known to arrange at least one module on a standardcarrier or a printed circuit board region of an accordingly simpleconfiguration in order to achieve the desired properties of differentpartial regions of such a printed circuit board. An embodiment of thistype is, for instance, known from WO 99/25163, wherein, in a printedcircuit board region or carrier of simplified design, recesses areprovided in a manner corresponding to the modules to be fixed, saidmodules to be fixed covering the recesses so as to ensure in the edgeregion of the recesses bonding by contact pads correspondingly providedon the edge regions of the modules to be fixed thereto. A similarconfiguration can also be taken from ES-A 216870. It is immediatelyapparent that the production of printed circuit boards each comprising aplurality of printed circuit board regions usually having differentstructures and different functions, which are to be disposed one abovethe other or horizontally, is extremely expensive and difficult due tothe usually provided large number of connections or the accordinglyminiaturized configuration. In addition, that known prior art involvesthe drawback that the end product, besides a substantially full-surfaceprinted circuit board region of usually simplified structureconstituting a carrier, comprises a plurality of further printed circuitboard regions projecting therefrom and connected therewith such thathandling may involve additional problems, particularly on account of theexisting irregular surface structures.

A similar mode of production of a printed circuit board having aplurality of printed circuit board regions can, for instance, also betaken from DE-U 93 09 973, wherein, again on a base circuit board, aprinted circuit board region that is, in particular, provided withlight-emitting devices, is contact-connected via contacts provided aboutedge or peripheral regions and projecting above respective recessesprovided in the base circuit board.

An electric circuit arrangement in compact construction of the initiallydefined kind can, for instance, be further taken from DE-A 2536316 orFR-A 2284190, wherein electric coupling is realized on an outer side viapower patterns and various elements can be inserted into the card,wherein it is, moreover, said that good heat dissipation properties areprovided.

SUMMARY OF THE INVENTION

The present invention aims to further develop a method and a printedcircuit board of the initially defined kind to the effect that theabove-mentioned drawbacks will be avoided when using and assemblingdifferent printed circuit board regions, wherein it is additionallyaimed to particularly provide a reliable connection and contacting aswell as a simple production of individual printed circuit board regionsand the integration thereof.

To solve these objects, a method of the initially defined kind isessentially characterized in that the additional layer is embodied as aconductive layer which is contact-connected via plated-through holes toconductive layers or devices or components integrated in the printedcircuit board regions to be connected to one another. Since the printedcircuit board regions to be connected to one another in the region of atleast one lateral surface or edge are connected or coupled to oneanother by a coupling or connection, it will be ensured that the printedcircuit board regions to be connected to one another will not mutuallyoverlap but rather be substantially adjacently arranged. Such aconnection in the region of at least one adjoining lateral surface willthus provide a substantially plane printed circuit board in whichdifferent partial regions that are, in particular, produced or providedseparately in a modular manner in different production steps and fulfillaccordingly different functions can be readily and reliably coupled orconnected to each other. The method according to the invention thusenables the optimization of the production process of the individualprinted circuit board regions, whereupon the latter can be connected orcoupled to one another in a simple and reliable manner to provide aprinted circuit board comprising different partial regions. Theconductive layer additionally provided by the invention willsubsequently enable the simple electrical contacting of the printedcircuit board regions to be connected to one another, which will berealized via the plated-through holes provided by the invention withintegrated layers and/or devices in the printed circuit board regions tobe connected. In accordance with the invention, a sandwiched structureof the printed circuit board consisting of a plurality of printedcircuit board regions will thus be made available, particularly byproviding accordingly plane structures for the subsequent patterning of,e.g., conducting layers or for the subsequent mounting of components.

For contacting or patterning, it is proposed according to a preferredembodiment of the invention that, after having connected or coupledprinted circuit board regions to be connected to one another and/orafter having arranged or applied at least one additional conducting orconductive layer or ply, the structuring or patterning of conducing orconductive layers of the printed circuit boards and/or the mounting ofadditional electronic components or devices on the printed circuit boardis/are effected.

Depending on the structure of the individual printed circuit boardregions to be connected and, in particular, in order to ensure completeinsulation relative to the conductive layer to be provided afterconnection, via which layer contacting is effected, it is proposedaccording to a further preferred embodiment that, prior to applying theadditional conductive layer, an insulating or non-conductive layer isapplied on the printed circuit board regions connected to one another.

In order to avoid partial regions having different heights, of theprinted circuit board to be produced, it is proposed according to afurther preferred embodiment that printed circuit board regions to beconnected to one another are substantially arranged in a common planeand connected or coupled to one another.

For an additional electrical coupling or connection of the printedcircuit board regions to be connected to one another, it is proposedaccording to a further preferred embodiment that an electricalconnection of electrically conducting or conductive regions or elementsof the printed circuit board regions to be connected to one anotherand/or layers of additional plies or additional elements is formed bysoldering, gluing, welding, riveting or pinning, by vias or passages,conductively made bores, conductive pastes, conductive foils or wires,electronic devices or components or optical connections.

For the reliable coupling of individual printed circuit board regions tobe connected to one another, it is proposed according to a furtherpreferred embodiment that the coupling or connection of the printedcircuit board regions to be connected to one another is effected bygluing, press-fitting, laminating, bonding, welding, soldering, agalvanic connection and/or by arranging or fixing components of theprinted circuit board. These are methods that are generally known perse, and widely used, in the context of printed circuit board productionprocesses such that the manipulation of individual printed circuit boardregions and their connection for the production of a printed circuitboard consisting of several printed circuit board regions can beperformed in an accordingly simple manner.

To further improve or simplify the coupling or connecting of printedcircuit board regions to be connected to one another, it is proposedaccording to a further preferred embodiment that at least one mutuallycomplementary coupling element is each formed on mutually adjoininglateral surfaces of the printed circuit board regions to be connected toone another, via which coupling element coupling or connecting to therespectively adjoining printed circuit board region is effected. Suchcomplementary coupling elements can be produced in an accordingly simplemanner and, in particular, are able to improve the mechanical stabilityof the connection of individual printed circuit board regions.

To further support the coupling or connecting of printed circuit boardregions to be connected to one another, it is, moreover, proposed in apreferred manner that complementary coupling elements are positivelyconnected to each other.

For an optionally desired embedment of at least one printed circuitboard region in a printed circuit board region to be connected thereto,it is, moreover, proposed that mutually adjoining lateral surfaces ofprinted circuit board regions to be connected to one another are formedwith mutually complementary profilings, particularly in the form ofstepped and/or through-going recesses or depressions, as incorrespondence with a further preferred embodiment of the methodaccording to the invention.

For the reliable incorporation or embedment of printed circuit boardregions having, for instance, complex structures in a printed circuitboard region forming a base of the printed circuit board, it is proposedaccording to a further preferred embodiment that the embedment of aprinted circuit board region in an accordingly formed recess ordepression of a printed circuit board region to be connected thereto iseffected, wherein, in addition to in each case at least one mutuallyadjoining lateral surface of the printed circuit board regions to beconnected to one another, an at least partial sheathing of the printedcircuit board region to be received is additionally provided on aperipheral surface different from the lateral surface.

In order to, in particular, compensate for different thicknesses ofprinted circuit board regions having different structures, it isproposed according to a further preferred embodiment that recesses ordepressions for receiving printed circuit board regions extend overseveral layers or plies of multilayer printed circuit board regions.This will, in particular, enable the adaptation of the thickness of aprinted circuit board region of a usually more complex structurecomprising a large number of plies to the thickness of a printed circuitboard region having an accordingly simpler structure.

As already pointed out above, it is feasible by using the methodaccording to the invention to connect or couple to one another, for theformation of a single or common printed circuit board, printed circuitboard regions of the most diverse configurations and structures, whereinthe printed circuit board regions to be connected to one anotheraccording to a further preferred embodiment are formed by flexible,rigid, rigid-flexible or semi-flexible printed circuit board regionsand/or high-frequency, HDI, substrate or ceramic printed circuit boardregions.

The production of rigid-flexible printed circuit boards, in particular,involves the problem that the rigid material, or rigid partial regions,of such a rigid-flexible printed circuit board exhibit good dimensionalstabilities during processing steps, especially laminating steps, whilethe flexible material has a comparatively poor stability. Due to thisinstability of, in particular, the flexible material or flexible partialregions, a printed circuit board will possibly exhibit considerabledeformations after relamination, which will subsequently lead toorientation problems if circuits, conducting elements or holes of smallsizes are to be positioned on the flexible layers, particularly relativeto the positions of corresponding circuits or conducting elements. Inorder to avoid misalignments, it is therefore common in the productionof rigid-flexible circuit boards or production formats to useconsiderably smaller production formats than in the production or rigidcircuit boards, such smaller production formats involving an increasedamount of work and elevated costs.

In the context of the method according to the invention, it is proposedaccording to a further preferred embodiment for the production ofrigid-flexible circuit boards, considering the advantages achievable bythe method according to the invention when coupling or connectingdifferent printed circuit board regions, that for the production of arigid-flexible printed circuit board a flexible printed circuit boardregion is formed with at least one adjoining transition region of rigidmaterial, and the transition region(s) of rigid material is/are coupledor connected to at least one) rigid printed circuit board region(s) ofthe rigid-flexible printed circuit board to be produced. Due to the factthat a flexible printed circuit board region is formed with at least oneadjoining transition region of rigid material and, after this, the atleast one transition region of rigid material is coupled to at least onefurther rigid printed circuit board region, it has become possible tomake the flexible partial regions small with, as the case may be, anaccordingly poorer dimensional stability and, by simultaneouslyproviding the at least one rigid transition region, provide a reliablecoupling to the separately produced, rigid printed circuit board regionsin order to produce the desired rigid-flexible printed circuit board.Taking into account the existing dimensional stability, an accordinglyprecise positioning of holes, vias or arrangement of circuit elementscan be performed on the separately produced, rigid printed circuit boardregions, wherein the flexible partial region of a usually smallerdimensional stability is connected to the rigid printed circuit boardregions in a subsequent operating step via the coupling between therigid transition region. Due to the separate production of the flexibleprinted circuit board region with at least one adjoining transitionregion usually having relatively small dimensions and made of rigidmaterial and the rigid printed circuit board regions, it has, moreover,become possible that usually more expensive, flexible printed circuitboard materials are to be used in a manner accordingly optimizedrelative to the actual dimensions of the flexible partial region to beproduced, so that additional respective cost advantages will beachievable in the production of rigid-flexible printed circuit boards.It is, moreover, possible to connect the separately produced, flexiblepartial regions with the adjoining at least one transition region ofrigid material as well as the rigid printed circuit board regions to beconnected or coupled thereto by using a largely automated assemblymethod such that, in particular, restrictions according to the knownprior art in respect to small production formats can likewise beminimized or completely eliminated in the production of rigid-flexibleprinted circuit boards.

To further improve the exploitation of, in particular, the moreexpensive, flexible material in the production of a rigid-flexibleprinted circuit board, it is proposed according to a further preferredembodiment that a flexible printed circuit board region with at leastone adjoining transition region is cut out of a carrier elementcomprising a plurality of such flexible printed circuit board regionsand is inserted in a respective recess of a carrier element likewisecomprising a plurality of rigid printed circuit board regions for thecoupling or connection with the at least one rigid printed circuit boardregion to be connected thereto. By an accordingly better exploitation ofthe, in particular, flexible material, it is thus possible to produce inseparate operating steps the flexible partial regions usually havingsmall dimensions for a plurality of rigid-flexible printed circuitboards to be produced, whereupon a simple and reliable connection tolikewise separately produced printed circuit board regions of rigidmaterial and of, for instance, elevated dimensional stability can beperformed.

The connection between, in particular, the at least one rigid transitionregion and the adjoining, rigid printed circuit board regions can beperformed according to one of the above-mentioned methods.

To solve the initially mentioned objects, a printed circuit board of theabove-identified type is, moreover, substantially characterized in thatthe additional layer is formed as a conductive layer, and thatplated-through holes are formed or provided between the additionalconductive layer and in the conductive layers or devices or componentsintegrated in the printed circuit board regions to be connected. Asalready pointed out above, a printed circuit board produced or assembledof several printed circuit board regions is thus provided in a simpleand reliable manner, said printed circuit board, in particular, enablingthe reliable electrical contacting of the printed circuit board regionsto be connected to one another.

In order to achieve the contact-connection of the individual printedcircuit board regions, particularly in accordance with predeterminedcircuit patterns, it is proposed according to a preferred embodimentthat the additional conductive layer is designed to be patterned and/ormounted with additional electronic devices or components.

Depending on the structure of the individual printed circuit boardregions to be connected and, in particular, in order to ensure completeinsulation relative to the conductive layer to be provided afterconnecting, via which conductive layer contacting is effected, it isproposed according to a further preferred embodiment that printedcircuit board regions to be connected to one another are substantiallyarranged in a common plane and connectable or coupleable to one another.

In order to provide an accordingly plane structure or avoid excessiveelevations of individual modules or printed circuit board regions, itis, moreover, proposed in a preferred manner that printed circuit boardregions to be connected to one another are substantially arranged in acommon plane and connectable or coupleable to one another.

For an additional and reliable electrical connection, it is, moreover,proposed that an electrical connection of electrically conducting orconductive regions or elements of the printed circuit board regions tobe connected to one another and/or layers of additional plies oradditional elements is formed by soldering, gluing, welding, riveting orpinning, by vias or passages, conductively made bores, conductivepastes, conductive foils or wires, electronic devices or components oroptical connections, as in correspondence with a further preferredembodiment of the printed circuit board according to the invention.

In a preferred manner, and in order to ensure proper connecting orcoupling, it is proposed according to a preferred embodiment thatcoupling or connecting of the printed circuit board regions to beconnected to one another is effected by gluing, press-fitting,laminating, bonding, welding, soldering, a galvanic connection and/or byarranging or fixing components of the printed circuit board.

In order to provide a reliable coupling as already indicated above, itis, moreover, proposed in a preferred manner that at least one mutuallycomplementary coupling element is each formed on mutually adjoininglateral surfaces of the printed circuit board regions to be connected toone another, via which coupling element a coupling or connection to therespectively adjoining printed circuit board region is feasible.According to a particularly preferred embodiment, it is additionallyproposed in this respect that mutually complementary coupling elementsare positively connectable to each other.

For the reliable incorporation of printed circuit board regions to beconnected to one another, it is, moreover, proposed in a preferredmanner that mutually adjoining lateral surfaces of printed circuit boardregions to be connected to one another are formed with mutuallycomplementary profilings, particularly in the form of stepped and/orthrough-going recesses or depressions.

For the embedment of printed circuit board regions having, inparticular, more complex structures in a printed circuit board regionforming a carrier and optionally having a simpler structure, it is,moreover, proposed that a printed circuit board region is receivable inan accordingly formed recess or depression of a printed circuit boardregion to be connected thereto, wherein, in addition to in each case atleast one mutually adjoining lateral surface of the printed circuitboard regions to be connected to one another, a sheathing of the printedcircuit board region to be received is additionally provided on aperipheral surface different from the lateral surface, as incorrespondence with a further preferred embodiment of the printedcircuit board according to the invention.

For the compensation of possibly different thicknesses of such printedcircuit board regions to be connected to one another, it is, moreover,proposed in a preferred manner that recesses or depressions forreceiving printed circuit board regions extend over several layers orplies of multilayer printed circuit board regions.

As already pointed out above, it is feasible to interconnect or coupledifferent configurations of printed circuit board regions according tothe present invention, wherein, in this respect, it is proposedaccording to a further preferred embodiment that the printed circuitboard regions to be connected to one another are formed by flexible,rigid, rigid-flexible or semi-flexible printed circuit board regionsand/or high-frequency, HDI, substrate or ceramic printed circuit boardregions.

In particular, in the context of the production of rigid-flexibleprinted circuit boards, it is proposed according to a further preferredembodiment that, for a rigid-flexible printed circuit board, a flexibleprinted circuit board region is formed with at least one adjoiningtransition region of rigid material, and the transition region(s) ofrigid material is/are coupled or connected to (at least one) rigidprinted circuit board region(s) of the rigid-flexible printed circuitboard to be produced. In this manner, it has become possible to producerigid-flexible printed circuit boards in a simple and reliable and alsoaccordingly cost-effective manner, as already discussed in detail above.

In accordance with the method of the invention, and by providing theprinted circuit board according to the invention, it has thus becomefeasible to produce as small as possible accordingly complex partialregions including, for instance, a digital or flexible region of aprinted circuit board, and to integrate the same in a printed circuitboard region of accordingly simpler structure. Such printed circuitboard regions can each be miniaturized so as to enable accordingly lowcosts and optimized production methods for individual printed circuitboard regions having, in particular, complex structures. It is,furthermore, possible to accommodate or embed such highly complexmodules or printed circuit board regions in a printed circuit boardregion constituting a carrier, for instance, as a function of standarddimensions to be met by the finished printed circuit board for furtheruse or for an installation in suitable equipment.

In addition, the method according to the invention as well as theprovision of the printed circuit board according to the invention allowfor simplified electrical contacting, wherein, by separating partialregions having different structures and different purposes of use, alsomutual influences, e.g., of high frequency and digital technologies,will be avoided. It is, in particular, possible to obtain a reduction ofthe surface area required for individual partial regions, and to improvethe flexibility both in the construction of printed circuit boardsmeeting different demands and in the assemblage of individual printedcircuit board regions.

The coupling proposed by the invention in the region of at least onemutually adjoining lateral surface or edge, in addition, allows for theprovision of a reliable and simplified, both mechanical and electrical,connection as compared to the known prior art, where, in particular,recesses of modules covering printed circuit boards or printed circuitboard carriers require complex contacting or bonding procedures.Furthermore, an electrical connection of the individual printed circuitboard regions can, moreover, be established by the arrangement of theadditional conductive layer and the plated-through holes, as alreadymentioned above.

Particularly when embedding a printed circuit board region in acorresponding recess or depression of a further printed circuit boardregion having, for instance, a simplified structure, soldering forconnecting individual printed circuit board regions can be renounced.Such embedment can, for instance, be realized by gluing or casting,whereby, after an accordingly simple connection or coupling, also an,optionally required, simplified insertion of further components will beenabled.

The method according to the invention and the printed circuit boardproduced according to the invention, furthermore, make available to auser printed circuit boards that have integrated all functions due tothe connection or coupling as well as contacting of individual printedcircuit board regions or modules will, for instance, be required on theuser or customer side.

SHORT DESCRIPTION OF THE DRAWINGS

In the following, the invention will be explained in more detail the wayof exemplary embodiments schematically illustrated in the accompanyingdrawing. Therein:

FIG. 1 shows a schematic section through a first embodiment of a printedcircuit board according to the invention, which is produced by themethod according to the invention;

FIG. 2 consists of FIGS. 2 and 2A. FIG. 2 shows a section through amodified embodiment of a printed circuit board according to theinvention in an illustration similar to that of FIG. 1, FIG. 2Aadditionally indicating a printed circuit board region (16′) to bereplaced;

FIG. 3 shows a section through a further modified embodiment of aprinted circuit board according to the invention, wherein printedcircuit board regions connected to one another are covered by thearrangement of additional layers or structures;

FIG. 4 is a top view of a further modified embodiment of a printedcircuit board according to the invention, with the arrangement andconnection of different printed circuit board regions being indicated;

FIG. 5, in an illustration similar to that of FIG. 4, depicts a furthermodified embodiment of a printed circuit board according to theinvention including a plurality of printed circuit board regionsconnected or coupled to one another;

FIG. 6 is a schematic section through a partial region of a furthermodified embodiment of a printed circuit board according to theinvention, wherein mutually complementary profilings for connecting orcoupling the printed circuit board regions to be connected to oneanother are indicated;

FIGS. 7, 8 and 9 depict further schematic sectional views of connectionsof printed circuit board regions of printed circuit boards according tothe invention, with a printed circuit board region being each receivedor embedded in a respective recess or depression of another printedcircuit board region;

FIG. 10 illustrates a further modified embodiment of, in particular,mutually complementary profilings or coupling elements of printedcircuit board regions to be connected to one another, of a printedcircuit board according to the invention; and

FIGS. 11 and 12 are further schematic illustrations of connectionregions, or coupling elements disposed therein, of printed circuit boardregions to be connected to one another, of printed circuit boardsaccording to the invention;

FIG. 13 illustrates a section through a further modified embodiment of aprinted circuit board according to the invention, in which a replacedprinted circuit board region is integrated;

FIG. 14 shows a printed circuit board according to FIG. 13, in whichinterconnected printed circuit board regions are additionally connectedby the arrangement of a conductive structure;

FIG. 15 consists of FIGS. 15A, 15B and 15C. FIG. 15 depicts schematicviews of method steps of the production of a rigid-flexible printedcircuit board according to the invention using the method of theinvention, FIG. 15A indicating the production of flexible printedcircuit board regions with at least one adjoining transition region,FIG. 15B indicating the separate production of rigid printed circuitboard regions to be connected to the flexible printed circuit boardregions produced according to FIG. 15A, and FIG. 15C indicating theremoval of flexible printed circuit board regions on the productionformat according to FIG. 15A and their insertion into the productionformat according to FIG. 15B comprising rigid printed circuit boardregions; and

FIG. 16, on an enlarged scale, illustrates a partial section through arigid-flexible printed circuit board as produced according to theembodiment of FIG. 15.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

In FIG. 1, three printed circuit board regions 1, 2 and 3 to beconnected to one another are schematically illustrated, the differentsetups or structures being schematically indicated by the use ofdifferent numbers of layers or plies. In addition, schematicallyindicated structures such as passages or vias 4 and 5 as well ascomponents or elements 6 and 7 integrated in the individual layers orplies are provided in the printed circuit board regions 1, 2 and 3.Moreover, patterns of conductive structures 8 are, in particular,indicated on the surface of the individual printed circuit boardregions, said structures 8 being formed in a conductive layer appliedafter the connecting or coupling of the printed circuit board regions 1,2 and 3.

In the region of respectively adjoining lateral surfaces 8 and 10 aswell as 11 and 12 of the printed circuit board regions 1, 2 and 3 to beconnected to one another, a mechanical connection of the printed circuitbeard regions 1, 2 and 3 are effected in addition to an electriccoupling or connection, for instance by gluing or soldering of theindividual printed circuit board regions, as is additionally indicatedbeside the structures or patterns 3 of the conductive layer, forinstance, by means of a device 13 for coupling between the printedcircuit board regions 1 and 2 and, for instance, provided in the form ofa printed connection 14 for connecting printed circuit board regions 2and 3.

In addition, plated-through holes 8′ are apparent both from thestructures 8 on the upper side of the printed circuit board regions 1, 2and 3 to be connected to one another and on the lower side, structures 8of a further conductive layer being also indicated.

The printed circuit board region 1 can, for instance, be formed by asimple printed circuit board element of region, which in patterned onboth sides. By contrast, the printed circuit board region 2 can, forinstance, be a multilayer high-frequency printed circuit board region,which is in turn coupled to the multilayer digital printed circuit boardregion 3.

The individual printed circuit board regions 1, 2 and 3 can beseparately produced in accordingly optimized production processes, afterwhich they are combined with one another to form a printed circuit boardfulfilling a plurality of different functions.

Instead of the connection indicated in FIG. 1, between the individualprinted circuit board regions 1, 2 and 3, the connections depicted inthe following Figures and comprising partially complementary or positiveprofilings can also be used.

FIG. 2, in a manner similar to the illustration according to FIG. 1,depicts a modified embodiment of a printed circuit board againconsisting of a plurality of printed circuit board regions 15, 16 and17, wherein it is again apparent that the individual printed circuitboard regions 15, 16 and 17 have different structures and/orcomplexities.

In the printed circuit board region 15, passive components 18 are, forinstance, included. By 19, patterns of a conductive layer applied afterconnecting the printed circuit board regions 15, 16 and 17 are againindicated, wherein plated-through holes or through-hole paths to layersarranged therebelow and/or components 18 are indicated by 19′.

Mechanical connecting or coupling in the region of the mutuallyadjoining lateral surfaces or edges again denoted by 9 and 10 and 11 and12, respectively, is again performed as in the preceding embodiment.

FIG. 2, in addition, schematically indicates that, for instance, at theoccurrence of an error of the printed circuit board region 16, e.g.,after an extended use of these printed circuit board regions 16, aseparation is again effected in the region of the mutually adjoininglateral surfaces 9, 10 and 11, 12, for instance by using a laser,whereupon a new functional printed circuit board region (16′) can againbe connected to the printed circuit board regions 15 and 17. In thismanner, highly complex and accordingly expensive printed circuit boardregions can, for instance, be replaced, thus avoiding an exchange of thewhole printed circuit board.

From FIG. 3, a further schematic illustration of a printed circuit boardproduced of printed circuit board regions 20, 21 and 22 is apparent,wherein, besides the simple structures of the printed circuit boardregions 20 and 22, the central printed circuit board region 21 comprisesa highly complex structure as indicated by a plurality of through-holepaths or vies 23. The multilayer structure of the printed circuit boardregion 21 is indicated by additional patterns 24 made of, in particular,conductive material and provided on different levels or plies.

From FIG. 3, it is moreover apparent that, after connecting or couplingof the printed circuit board regions 20, 21 and 22 to be connected toone another, additional layers or plies 25, 26 of a multilayer printedcircuit board are applied, particularly on both sides, so that theprinted circuit board regions 20, 21 and 22 connected to one another aresubstantially fully integrated or incorporated in a thus completedprinted circuit board.

The contacting of individual partial regions of the printed circuitboard regions 20, 21 and 22, or of inwardly disposed conductivestructures 24, is realized via plated through holes 23 which areconnected to patterns of the conductive layer 26 after having penetratedthe insulating or non-conductive layer 25.

From the schematic top views of FIGS. 4 and 5, it is apparent thatprinted circuit board regions to be connected, unlike in the embodimentsparticularly illustrated in FIGS. 1, 2 and 3, where adjacently locatedprinted circuit board regions are connected to each other, arecorrespondingly inserted in partial regions of a base carrier so as toenable a connection of such printed circuit board regions not only on alateral surface or side edge.

In the illustration according to FIG. 4, a printed circuit board region27 having, for instance, substantially square outer dimensions isconnected or coupled to a printed circuit board region 28 comprising acorresponding recess. Besides a mechanical connection or coupling asalready indicated above and subsequently explained in more detail, theembodiment illustrated in FIG. 4, for instance, additionally compriseswires 29 for the electric coupling of individual regions. Instead ofusing wires 29, a connection of conducting or conductive regions (notillustrated) of the individual partial regions 27 and 28 can also berealized by appropriate connectors or plugs, or by bonding.

From the illustration according to FIG. 5, it is apparent that differentprinted circuit board regions 30, 31 and 32 are integrated or receivedin printed circuit board regions 34 optionally having simpler setupssuch that the printed circuit board regions 30, 31 and 32 are eachconnected to the surrounding printed circuit board region 34substantially relative to their entire peripheries.

FIG. 6 schematically indicates a connection between printed circuitboard regions 35, 36 and 37, wherein, for instance, contrary to theembodiments illustrated in FIGS. 1, 2 and 3, in which substantiallyplane lateral surfaces are provided in an adjacent manner, the mutuallyadjoining lateral surfaces are formed with coupling elements orprofilings 38 and 39 which, in the illustration according to FIG. 6,result in a substantially stepped structure.

In addition to an accordingly simplified mechanical coupling viastep-like complementary profilings 38 and 39, of the printed circuitboard regions 35, 36 and 37 to be connected to one another, theelectrical contacting of individual partial regions, in the region ofthese partially overlapping coupling elements 38 and 39, can also bedirectly effected, for instance by providing conductive bores or vias orappropriate through-hole paths or plated-through holes, as isschematically indicated by 40. Besides such electrical contacting 40,mechanical connections formed, for instance, by rivets or pins, mayfurther be provided.

FIGS. 7, 8 and 9, furthermore, depict schematic embodiments ofconnections of printed circuit board regions, wherein a recess ordepression 42, 43 and 44, respectively, is each provided in a printedcircuit board region 41 optionally having a simple structure. Printedcircuit board regions 45, 46 and 47 of, in particular, appropriate outerdimensions are inserted in the recesses or depressions, 42, 43 and 44,respectively, so as to ensure the embedment, and hence accordinglysecured fixation, of the individual printed circuit board regions 45, 46and 47 by the arrangement or fixation of the printed circuit boardregions 45, 46 and 47 in the recesses or cavities or hollow spaces ofthe printed circuit board region 41.

The fixation in such recesses or depressions 42, 43, 44 can, forinstance, be effected by gluing or simple press fitting. Concerningelectrical contacting options, it is referred to the precedingembodiments.

In this manner, highly complex printed circuit board regions 45, 46, 47optionally having small dimensions can, in particular, be inserted inprinted circuit board regions 41 optionally having simpler structures.

In FIGS. 10, 11 and 12, further modified embodiments of a particularlymechanical connection between printed circuit board regions to beconnected to one another are illustrated.

In the embodiment according to FIG. 10, respectively outwardly disposedprinted circuit board regions 48 and 49, in the region of the mutuallyadjoining lateral surfaces 50 and 51, each comprise an incision ordepression 52, 53, in which the respective projections 54 and 55 of acentral printed circuit board region 56 to be coupled thereto arereadily coupleable. Such complementary depressions or recesses 52, 53and projections 54, 55 are, in particular, able to provide anaccordingly safe mechanical connection between the individual printedcircuit board regions.

Further modified embodiments are illustrated in FIGS. 11 and 12, whereinadditional recesses or depressions 61 and 62 or 63 and 64, respectively,are provided or indicated in the region of the lateral surface 59 and 60to be connected, between schematically indicated printed circuit boardregions 57 and 56, wherein, in order to ensure proper mechanicalcoupling, additional coupling elements 65 and 66 are respectivelyprovided, which, for instance by an adhesive 67 schematically indicatedin the region of the connection site, will result in a proper connectionof the mutually adjoining printed circuit board regions 57 and 58 to beconnected to one another.

For the sake of simplicity of the illustrations, FIGS. 4 to 12, whichbasically relate to different connections, do not show the conductivematerial layer to be additionally applied after having connected theprinted circuit board regions, nor do they indicate the requiredplated-through holes except for FIG. 6.

FIG. 13 depicts a further modified embodiment, in which a printedcircuit board region has been removed from a completed printed circuitboard 68, e.g. after an extended period of use or a failure of a printedcircuit board region, for instance by partially separating the printedcircuit board 68 by the aid of a laser, and after this a new functionalprinted circuit board region 69 has been inserted, with a plurality ofnon-conducting layers of larger thicknesses and accordingly thinnerconducting layers being indicated. The conductive structure or layer 70of the printed circuit board 68 was not severed to replace the, forinstance, defect printed circuit board region, and the new functionalprinted circuit board region 69 was inserted in place of the removedprinted circuit board region, the contacts or plated-through holes 71 inthe region of the conductive structure 70 having been maintainedunchanged. Such a replaced printed circuit board region 69 willsubsequently be again connected with the remaining printed circuit boardregions 72 and 73 of the printed circuit board 68 by gluing, laminating,bonding or the like. With such a use, an accordingly complex andexpensive defect printed circuit board region can, for instance, bereplaced with an identical or even modified printed circuit board region69 such that the complete substitution of the entire circuit board canbe renounced.

Finally, all other elements of the original printed circuit board 68such as devices 74 and contacts 71 can be retained.

FIG. 14 depicts a modified variant of the substitution for a printedcircuit board region, in which, for instance, a defect printed circuitboard region has again been removed from a printed circuit board 75,wherein, as pointed out in connection with FIG. 23, a conductivestructure 76 covering the entire circuit board 75 was not severed whenremoving the printed circuit board region. After having inserted a newprinted circuit board region 77 into the printed circuit board 75 andconnected this printed circuit board region with the printed circuitboard regions 78 and 79 of the printed circuit board 75 by bonding,gluing, soldering or the like, an additional conductive structure 80 isapplied either over the entire printed circuit board 75 renderedfunctional again or, e.g., only on the new printed circuit board region77, so that the entire circuit board 75 will be covered by theadditional conductive layer or structure 80. This conductive region 80is additionally provided with devices 81. Similarly as with theconfiguration according to FIG. 13, the contacts or plated-through holes82 provided in the region of the conductive structure 76 in this variantcan, in particular, be maintained unchanged, thus enabling aparticularly rapid and cost-effective replacement of a defect printedcircuit board region. Appropriate feedthroughs 82 are also provided inthe conductive layer or structure 80 disposed on the upper surface.

For the printed circuit board regions schematically illustrated in thepreceding Figures, different circuit board elements can be used asalready indicated, the latter being, for instance, comprised ofhigh-frequency parts, HDI circuit boards, substrate circuit boards,flexible, rigid-flexible or semi-flexible circuit board regions or,optionally, ceramic circuit board regions.

To produce recesses or free spaces for receiving printed circuit boardregions as are, for instance, apparent from the illustrations accordingto FIGS. 4 and 5, milling, punching, laser or water jet cutting, plasmaetching or the like may, for instance, be applied. By appropriatemilling or punching or cutting, mutually adjoining lateral surfaces oredges can be formed with matching profiles, e.g. in the form of steps asillustrated in FIG. 6.

The recesses or depressions illustrated in FIGS. 7, 8 and 9 can, forinstance, be provided by pressing, imprinting or by clearing therespective recesses or depressions.

In addition to the above-mentioned options of providing a mechanicalconnection by gluing or press-fitting, a mechanical connection betweenthe printed circuit board regions to be connected to one another mayalso be effected by laminating, soldering or a galvanic connection.Furthermore, a connection can be made by ultrasonic welding, laserwelding or riveting or pinning as already indicated with reference toFIG. 6.

An electrical connection between the individual conducting or conductiveregions of the printed circuit board regions to be connected to oneanother, in addition to the formation of through-hole paths orplated-through holes, conducting bores or vies as already indicatedabove, can be realized by arranging components or devices bridging theprinted circuit board regions to be connected to one another, by gluing,e.g. by using an anisotropic adhesive or adhesive tape, by welding,again by riveting or pinning, by an optical connection of by the aid ofconductive pastes and/or foils. Such conductive dyes or inks can beapplied by printing methods.

Instead of the substantially complete sheathing or embedment illustratedin FIGS. 7, 8 and 9, of the printed circuit board regions 45, 46 and 47to be incorporated, hollow spaces may also be left in the region of therecesses 42, 43 or 44 after the incorporation or insertion of theprinted circuit board regions 45, 46 and 47 to be incorporated.

From the illustration according to FIG. 15A of a further modifiedembodiment, it is apparent that a plurality of flexible printed circuitboard regions denoted by 90 are incorporated in a common carrier element91 and processed within the same according to known method steps for theproduction of printed circuit boards, wherein FIG. 15A shows that acomparatively large production format or carrier element 91 is used ancompared to known embodiments. From FIG. 15A, it is, moreover, apparentthat the usually more expensive, flexible material used for theproduction of the flexible partial regions 90 can be utilized in anaccordingly optimized manner, since in the method step represented inFIG. 15A a large number of in each case flexible partial regions 90 areproduced at small mutual distances, over which also the flexible circuitboard material extends.

Similarly, and as illustrated in FIG. 15B, a plurality of rigid printedcircuit board regions 92 are produced in a separate production method,said plurality of rigid printed circuit board regions 92 being receivedin a carrier element denoted by 93. In the region of the flexiblepartial regions 90 to be subsequently inserted, as illustrated in detailin FIG. 15C, free spaces or intervals 94 are each provided betweensubsequently cooperating rigid printed circuit board regions 92. Therigid printed circuit board regions 92 are likewise processed andproduced according to production processes known for the formation of,in particular, multilayer printed circuit boards.

From the illustration according to FIG. 15C, it is apparent that afterhaving completed the flexible printed circuit board regions 90 thelatter are removed from the carrier element 91, for instance byseparation methods known per no, wherein it in apparent from theillustration according to FIG. 15C, that each of the flexible elementscomprises a transition region 95 of rigid material, whereby couplingwith the rigid printed circuit board regions 92 is performed by the aidof said transition region 95 during insertion into the free spaces 94.

The coupling of the individual partial regions 90 and 92 isschematically illustrated in FIG. 16, from which it is apparent that theflexible partial region 90 comprises a flexible material regionschematically denoted by 96, which is followed by the transition regionsagain denoted by 95.

In the region of the separation line 97 indicated in broken lines,coupling occurs between the transition regions 95 and the rigid partialregions 92 following thereupon. In the illustration according to FIG.16, electrical couplings are, moreover, indicated, via which directcoupling between conductive elements of the flexible material 96 and theconsecutively arranged rigid regions 95 as well as 92 by the aid of aconductive layer 99 disposed in the region of the separation line 97after coupling or connecting is thus effected. An insulating ornon-conductive layer may be provided below the conductive layer 99 as afunction of the structure of the printed circuit board regions 92 and 95to be connected.

From the illustration according to FIG. 16, it is, moreover, apparentthat the more expensive, flexible printed circuit board material 96actually extends substantially only over the flexible partial region 90and in the immediately adjoining transition regions 95, while theflexible circuit board material, unlike in known embodiments accordingto the prior art, is not present in the adjoining, rigid regions 92.

The schematically indicated coupling or connection in the region of theseparation line 97 in this case is realized according to the connectionsdiscussed in detail in the preceding exemplary embodiments, in theregion of mutually adjoining surfaces or end faces of printed circuitboard regions to be connected to one another.

What is claimed:
 1. A printed circuit board consisting of at least twoprinted circuit board regions, wherein the printed circuit board regionseach comprise at least one conductive layer and/or at least one deviceor one conductive component, wherein the printed circuit board regionsto be connected to one another, in a region of in each case at least onelateral surface directly adjoining one another, are connected to oneanother by a coupling or connection, and wherein, on the printed circuitboard regions connected to one another, at least one common additionalconductive layer of the printed circuit board is arranged on the printedcircuit board regions to be connected to one another, whereinplated-through holes are formed or provided between the commonadditional conductive layer and in the conductive layers or devices orcomponents integrated in the printed circuit board regions to beconnected, wherein at least one common insulating or non-conductivelayer is provided between the printed circuit board regions to beconnected to one another and the common additional conductive layer,wherein a printed circuit board region is received in an accordinglyformed recess or depression of a printed circuit board region to beconnected thereto, wherein, in addition to in each case at least onemutually adjoining lateral surface of the printed circuit board regionsto be connected to one another, a sheathing of the printed circuit boardregion to be received is additionally provided on a peripheral surfacedifferent from the lateral surface; wherein the printed circuit boardregions to be connected to one another are substantially arranged in acommon plane and connected or coupled to one another; and wherein atleast one mutually complementary coupling element is each formed onmutually adjoining lateral surfaces of the printed circuit board regionsto be connected to one another, via which coupling element a coupling orconnection to the respectively adjoining printed circuit board region isfeasible.
 2. The printed circuit board according to claim 1, wherein thecommon additional conductive layer is designed to be patterned and/ormounted with additional electronic devices or components.
 3. The printedcircuit board according to claim 1, wherein an electrical connection ofelectrically conducting or conductive regions or elements of the printedcircuit board regions to be connected to one another and/or layers ofadditional plies or additional elements is formed by soldering, gluing,welding, riveting or pinning, by vias or passages, conductively madebores, conductive pastes, conductive foils or wires, electronic devicesor components or optical connections.
 4. The printed circuit boardaccording to claim 1, wherein the coupling or connection of the printedcircuit board regions to be connected to one another is effected bygluing, press-fitting, laminating, bonding, welding, soldering, agalvanic connection and/or by arranging or fixing the components of theprinted circuit board.
 5. The printed circuit board according to claim1, wherein mutually complementary coupling elements are positivelydesigned.
 6. The printed circuit board according to claim 1, wherein themutually adjoining lateral surfaces of the printed circuit board regionsto be connected to one another are formed with mutually complementaryprofilings in the form of stepped and/or through-going recesses ordepressions.
 7. The printed circuit board according to claim 1, whereinrecesses or depressions for receiving the printed circuit board regionsextend over several layers or plies of multilayer printed circuit boardregions.
 8. The printed circuit board according to claim 1, wherein theprinted circuit board regions to be connected to one another are formedby flexible, rigid, rigid-flexible or semi-flexible printed circuitboard regions and/or high-frequency, HDI, substrate or ceramic printedcircuit board regions.
 9. The printed circuit board according to claim1, wherein, for a rigid-flexible printed circuit board, a flexibleprinted circuit board region is formed with at least one adjoiningtransition region of rigid material, and the transition region(s) ofrigid material is/are coupled or connected to (at least one) rigidprinted circuit board region(s) of the rigid-flexible printed circuitboard to be produced of the printed circuit board regions to beconnected to one another, via which coupling element a coupling orconnection to the respectively adjoining printed circuit board region isfeasible.